Today's plate mills must fulfill challenging requirements since:
- Plates become increasingly wider
- During the low-temperature passes in thermo-mechanical
rolling, the drives
have to generate extremely high and
precise torque
- To obtain precise plate tracking and movement, the drives
used in batch
rolling and high-tech cooling must deliver the
highest degree of accuracy
The Siemens answer is the completely integrated solution of SIROLL PM. Motors and drives – the most powerful available – have established themselves as an economical, versatile solution in plate mills. With low maintenance and great efficiency they offer everything you need for minimizing life-cycle costs.
Mastering production processes means that they have to be fully understood and mapped in physical-metallurgical models. Modeling is necessary to characterize the effects of individual parameters on the complete process. The Siemens VAI process models are a solid basis for our leading automation solutions, especially in the area of heavy-plate technology. In conjunction with our process and basic automation, they permit the mill operator to utilize a wide range of rolling schedules like batch rolling, tapered plate rolling, plant view control and others in fully automatic operation.
A comprehensive material tracking starting from the slab yard ensures the seamless data flow and consistent allocation of all process and quality related data down to the delivery area of the finished products.
| Plate Mill w. edger | Plate Mill w.o. edger | Steckel Mill | Plate-Steckel Mill | |
| Pass-schedule calculation and mill setup | X | X | X | X |
| Multipoint setup | X | X | X | X |
| Temperature setup | X | X | X | X |
| Cooling control | X 1) | X 1) | X 2) | X 2) |
| Thermo-mechanical rolling | X | X | - | X |
| Multi-piece tandem (batch-) rolling | X | X | - | X |
| PFC - profile and flatness control | X | X | X | X |
| STC - smoothed tapering control for tapered plates | X | X | - | X |
| PVPC - Plan view pattern control | X | X | - | - |
| Short-stroke control | X | - | (X) | (X) |
| Mill pacing | X | X | X | X |
| Microstructure monitor | X | X | X | X |
| Levelling Model & Control | X | X | - | X |
| MES functionality | X | X | X | X |
| Main Drives | X | X | X | X |
| Auxilliary Drives | X | X | X | X |
| Measurement & Instrumentation | X | X | X | X |
1) Mulpic® ACC and DQ plate cooling
2) MSTC = Laminar cooling with Microstructure Target Cooling